1. Molding Technology
Dry Pressing: Suitable for simple-shaped parts, low cost but limited precision.
Injection Molding: Can manufacture complex structures, such as miniature ceramic gears, requires a large amount of binder.
Casting: Used to produce ultra-thin ceramic substrates (thickness <0.1mm).
2. Sintering Processes
Atmospheric Pressure Sintering: High economic efficiency, but lower density.
Hot Isostatic Pressing (HIP): Improves material density through a high-pressure argon environment, achieving performance close to theoretical values.
3. Precision Machining Technology
Diamond Grinding: Uses diamond wheels for machining flat or curved surfaces, with precision up to ±1μm.
Laser Machining: Femtosecond lasers can achieve micron-level drilling, used for through-hole fabrication in ceramic circuit boards.
Ultrasonic Machining: Utilizes high-frequency vibration to break materials, suitable for machining brittle ceramics such as zirconia.
4. Surface Treatment
Chemical Mechanical Polishing (CMP): Used for nanoscale planarization of semiconductor ceramic substrate surfaces.
Coating technology: Depositing a TiN coating on the tool surface to improve wear resistance.